Conductive hook and loop attachment for a printed circuit board

ABSTRACT

The present disclosure is directed to conductive connector attachments for use in electrically connecting printed circuit boards to absorbent products such as diapers, training pants, incontinence products, feminine hygiene products, and the like. Specifically, various configurations and methods of securely attaching conventional conductive hook and loop attachments to printed circuit boards are disclosed.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation application, claiming priority toU.S. patent application Ser. No. 12/406,416, which is a divisionalapplication filed Mar. 18, 2009, claiming priority to U.S. patentapplication Ser. No. 11/740,671, which was filed Apr. 26, 2007. U.S.patent application Ser. Nos. 12/406,416 and 11/740,671 are incorporatedherein in their entireties.

BACKGROUND OF DISCLOSURE

The present disclosure generally relates to conductive connectorattachments for printed circuit boards. More specifically, the presentdisclosure is directed to conductive hook and loop attachments forprinted circuit boards.

Current consumer electronic assembly is dominated with metal conduitsand connections due to their high reliability, reasonable cost, andexcellent electrical characteristics. Conventionally, printed circuitboards have been connected to integrated circuit semiconductor chips andthe like using some type of intermediate device carrier. One such typeof interconnection mounts the integrated circuit chip on a circuit chipcarrier or module, which module in turn is mounted onto the circuitboard. In a particularly well known type of interconnection mount, theintegrated circuit chip is mounted onto a ceramic module by “flip-chip”bonding wherein the I/O pads on the face of the chip are bonded tocorresponding pads on the module, such connection being formed by use ofsolder bumps or solder balls normally using solder reflow techniques.Such connections are often referred to as C4 connections. The ceramicmodule conventionally has a wiring structure either on the surfacethereof or more usually on the surface and also buried therein whichfans out, and vias formed of conducting material pass through the moduleterminating on the opposite side thereof. Conventionally, the oppositeside of the module is provided with an array of pins, which pins in turnare positioned to be inserted into a complementary array of holes on acircuit board. This type of mounting of a module to a board is commonlyknown as “pin-in-hole” mounting. Mounting of a chip to module or moduleto board by these types of connections is well known in the art andfurther, is shown in U.S. Pat. No. 4,415,025, assigned to IBM.

Recently, however, consumer electronics have spread into non-traditionalproduct categories such as consumer products and textiles. For example,various types of electronic moisture or wetness indicators have beensuggested for use in disposable absorbent articles such as diapers. Thewetness indicators may include alarm devices that are designed to assistparents or attendants in identifying a wet diaper condition early on.The indicator devices typically produce either a visual or an audiblesignal.

Problems, however, have been encountered in designing an attachmentmechanism for the signaling device that allows for a very reliableattachment of the signaling device to the conductive leads while notappreciably increasing the cost of the absorbent article. For example,currently machined metal connectors are required for the alarm signalsin absorbent articles to penetrate the liner materials and engage in theunderlying foils. These metal conductors, being specially created forthis task, are inherently low volume and are considered a premium.

Furthermore, while alternatives to metal connectors, such asconventional conductive plastics and conductive threads, are known,these materials have been unable to attach the devices to the articlessatisfactorily. Specifically, many times the connection resistance of aproximal connection between a connector and a conductive path on thefabric will produce areas where the connector attachment buckles awayfrom the underlying conductive patch, thereby varying the surface areaof contact and varying the resistance of the connection. Furthermore,the affinity of solder materials typically used in attaching these typesof connectors to printed circuit boards is low and, as such, whenattempting to directly solder a patch of a connector onto a printedcircuit board, a cold solder joint is formed which results in thethermoplastic material of the connector cracking away from the soldermaterial, producing an unsatisfactory bond.

As such, there is a need in the art for a conductive connectorattachment for use in consumer products and textiles capable of securelyattaching to a printed circuit board, while providing good electricalconnection. Additionally, it would be advantageous if the conductiveconnector attachment was low in cost and could be produced in highvolume.

SUMMARY OF THE DISCLOSURE

The present disclosure generally relates to conductive connectorattachments for use in electrically connecting printed circuit boards toconsumer absorbent products and textiles such as diapers, trainingpants, incontinence products, feminine hygiene products, and the like.Specifically, in one example, one half of a conductive hook and loopattachment can be connected to a printed circuit board, and the secondhalf can then be attached to the chassis of a diaper.

The hook and loop attachments can be any conventional hook and loopattachment known in the art and, as such, can be produced relativelycheaply and in high volume. Furthermore, the attachment configurationsdisclosed in the present disclosure provide good electrical conductivityand a sufficiently secured mechanical attachment to a printed circuitboard.

As such, the present disclosure is directed to a conductive connectorattachment for a printed circuit board. The conductive connectorattachment comprises a conductive hook material, a printed circuitboard, a solder material, and a conductive loop material. The conductivehook material comprises a contact side, an opposing non-contact side,and at least one hole that continues from the non-contact side to thecontact side. The contact side comprises multiple hooks. The hole in theconductive hook material is filled with the solder material therebyelectrically connecting the printed circuit board to the non-contactside of the conductive hook material. Furthermore, the conductive loopmaterial is compatible with the contact side of the conductive hookmaterial and, as such, can be securely fastened thereto.

The present disclosure is further directed to a conductive connectorattachment for a printed circuit board. The conductive connectorattachment comprises a conductive hook material, a printed circuitboard, and a conductive loop material. The conductive hook materialcomprises a contact side and an opposing non-contact side. The contactside comprises multiple hooks. The non-contact side comprises at leastone stud. The printed circuit board comprises at least one via, whereinthe stud of the conductive hook material is compatible with the via andcan be fitted into the via, thereby electrically connecting the printedcircuit board to the non-contact side of the conductive hook material.In one embodiment, a solder material can be applied to the studmaterial, allowing for an even stronger connection between the printedcircuit board and the conductive hook material. Furthermore, theconductive loop material is compatible with the contact side of theconductive hook material and, as such, can be securely fastened thereto.

The present disclosure is further directed to a conductive connectorattachment for a printed circuit board. The conductive connectorattachment comprises a conductive hook material comprising a contactside and an opposing non-contact side, a printed circuit board, a metalscrim layer located between the non-contact side of the conductive hookmaterial and the printed circuit board, a solder material, and aconductive loop material. The contact side of the conductive hookmaterial comprises multiple hooks. The solder material electricallyconnects the metal scrim layer to each of the non-contact side of theconductive hook material and the printed circuit board. Furthermore, theconductive loop material is compatible with the contact side of theconductive hook material and, as such, can be securely fastened thereto.

The present disclosure is further directed to a conductive connectorattachment for a printed circuit board. The conductive connectorattachment comprises a conductive hook material, a printed circuitboard, a solder material, and a conductive loop material. The conductivehook material comprises a contact side and an opposing non-contact side.Both of the contact side and non-contact side comprise multiple hooks.The solder material electrically connects the hooks of the non-contactside of the conductive hook material to the printed circuit board.Furthermore, the conductive loop material is compatible with the contactside of the conductive hook material and, as such can be securelyfastened thereto.

Other objects and features will be in part apparent and in part pointedout hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A depicts a top view of one configuration for the conductiveconnector attachment of the present disclosure.

FIG. 1B depicts a side view of the configuration for the conductiveconnector attachment shown in FIG. 1A.

FIG. 2A depicts a side view of a second configuration for the conductiveconnector attachment of the present disclosure.

FIG. 2B depicts a top view of the configuration for the conductiveconnector attachment shown in FIG. 2A.

FIG. 3A depicts a side view of a third configuration for the conductiveconnector attachment of the present disclosure.

FIG. 3B depicts a bottom view of the configuration for the conductiveconnector attachment shown in FIG. 3A.

FIG. 4 depicts a side view of a fourth configuration for the conductiveconnector attachment of the present disclosure.

FIG. 5A depicts a side view of a fifth configuration for the conductiveconnector attachment of the present disclosure.

FIG. 5B depicts a side view of the sixth configuration for theconductive connector attachment shown in FIG. 5A.

FIG. 5C depicts a side view of a seventh configuration for theconductive connector attachment of the present disclosure.

Corresponding reference characters indicate corresponding partsthroughout the drawings.

DETAILED DESCRIPTION OF THE DISCLOSURE

The present disclosure is directed to conductive connector attachmentsfor use in electrically connecting printed circuit boards to absorbentproducts such as diapers, training pants, incontinence products,feminine hygiene products, and the like. Specifically, the inventorshave discovered various configurations and methods of securely attachingconventional conductive hook and loop attachments to printed circuitboards to produce conductive connector attachments having goodelectrical conductivity.

As noted above, the conductive connector attachments include conductivehook and loop materials and a printed circuit board. The conductive hookmaterial for use in the conductive connector attachment of the presentdisclosure generally comprises a conductive thermoplastic material.Suitable thermoplastic materials can include materials such aspolyolefins, nylon, styrene block copolymers, and combinations thereof.In a particularly preferred embodiment, the hook material is made frompolypropylene, polyethylene, or a combination thereof. In an alternativepreferred embodiment, the hook material is made fromstyrene-butadiene-styrene block copolymer.

The hook material may be made conductive, for instance, by incorporatinga conductive material such as carbon fibers, carbon black particles,metallic fibers, and metal coated fibers into the thermoplastic fibersof the material. In another embodiment, the hook material may be madefrom conductive threads.

Alternatively, in one particularly preferred embodiment, the hookmaterial is made conductive by coating the hook material with aconductive material, such as by vapor depositing a metal on the surfaceof the hook material. Specifically, the conductive hook material may bevapor deposited with a metal selected from the group consisting ofaluminum, copper, iron, silver, gold, nickel, zinc, tin, andcombinations thereof. In one particularly preferred embodiment, theconductive hook material is produced by vapor depositing aluminum ontothe surface of the hook material. Typically, to produce a sufficientlyconductive hook material, the metal is vapor deposited onto the surfaceof the conductive hook material in a thickness of from about 20angstroms to about 800 angstroms. More suitably, the metal is vapordeposited onto the surface of the conductive hook material in athickness ranging of from about 100 angstroms to about 400 angstromsand, even more suitably, a thickness of from about 140 angstroms toabout 275 angstroms.

Commercially available conductive hook material are available asconductive VELCRO hook fasteners (available from Velcro USA, Inc.,Manchester, N.H.).

Generally the conductive hook material comprises a contact side that iscompatible with its mating part, a conductive loop material. The contactside of the conductive hook material comprises multiple hooks, whichengage in the loops present on the surface of the conductive loopmaterial. To provide a sufficiently secure attachment from the hookmaterial to the loop material, the hooks on the contact side of theconductive hook material are suitably from about 1 micron to about 5millimeters in length. More suitably, the hooks are about 1 micron toabout 1 millimeter in length.

The conductive hook material further comprises an opposing side from thecontact side, termed the non-contact side, which will face away from theconductive loop material. The non-contact side can be a smooth surface,can comprise one or more studs, or can comprise multiple hooks similarto the contact side, as discussed more fully below, which will contact asignaling device such as the printed circuit board of the presentdisclosure.

The conductive loop material is suitably formed of similar thermoplasticmaterial as the conductive hook material. Moreover, the loop materialcan be made conductive using similar means as described above for theconductive hook material. In one particularly preferred embodiment, theconductive loop material is produced by vapor depositing a conductivemetal to the surface of the loop material.

Similar to the conductive hook material, the conductive loop materialcomprises multiple loops, ranging from about 1 micron to about 5millimeters in length. More suitably, the loops are from about 1 micronto about 1 millimeter in length.

In general, the sizes of the conductive hook material and conductiveloop material may vary depending upon the desired application. Thematerials, for example, may have any size sufficient to facilitate anelectrical connection with a corresponding signaling device such as theprinted circuit board. Suitable sizes of the conductive hook materialand conductive loop material include, for example, a surface area of atleast about 0.5 cm². More suitably, the conductive hook material andconductive loop material have a surface area of at least about 1 cm²,even more suitably, at least about 2 cm² and, even more suitably, atleast about 3 cm². Suitable conductive hook and loop materials are thetype commercially available under the Trademark VELCRO (available fromVelcro USA, Inc., Manchester, N.H.).

The conductive hook material and conductive loop material are eachconfigured to electrically connect to a signal device. Specifically, inone embodiment, the conductive hook material is electrically connectedto a printed circuit board. The printed circuit board of the presentdisclosure can be any printed circuit board known in the art suitablefor use in consumer absorbent products or textiles. For example, in oneembodiment, the printed circuit board is a multi-layer printed circuitboard made by a method disclosed by, for example, Japanese Patent LaidOpen No. 9-130050. Generally, a rough layer is formed on the surface ofthe conductor circuit of a printed circuit board by electroless paintingor etching. Then, an interlayer insulating resin is applied, exposed anddeveloped by a roll coater or printing, via hole and opening portionsare formed for making layers continuous, and an interlayer resininsulting layer is formed through UV hardening, actual hardening, andthe like. Further, a catalyst such as palladium is applied onto theinterlayer resin insulting layer on the rough surface which has beensubjected to a roughing process with an acid or an oxidizer. A thinelectroless plated film is formed, a pattern is formed on the platedfilm by a dry film and the thickness of the pattern is increased byelectroplating. Thereafter, the dry film is separated and removed by analkali and etched to thereby form a conductor circuit. By repeating theabove processes, a buildup multi-layer printed circuit board isobtained.

Typically, the printed circuit board of the present disclosure has athickness ranging from about 5 millimeter to about 125 millimeters. Moresuitably, the printed circuit board has a thickness of from about 20millimeters to about 100 millimeters and, even more suitably, from about30 millimeters to about 65 millimeters.

When attaching the printed circuit board to the conductive hook material(or conductive loop material), mechanical and electrical connectiontypically occurs on the printed circuit board at sites referred to assolder pads. The solder pads can range is size depending on the desiredapplication. Suitable ranges for the size of the solder pads are fromless than about 1 mm×1 mm to about 3 mm×7 mm. Typically, the size of thesolder pad should match the electrical component being used for acomplete electrical and mechanical connection. One particularly suitablesize for the solder pad can be, for example, a 3 mm×7 mm area.

According to the present disclosure, one or more components of theconductive connector attachment is configured to electrically connecteither the conductive hook material or the conductive loop material tothe printed circuit board using either compression fit or solderingmechanisms. For example in one embodiment, as shown in FIGS. 1A and 1B,the conductive hook material 1 is configured to connect to the printedcircuit board 3 using conventional soldering mechanisms. Specifically,in this embodiment, the conductive hook material 1 comprises at leastone hole 5A, more suitably multiple holes 5A, 5B, that continues fromthe non-contact side 7 to the contact side 9 of the conductive hookmaterial 1. Typically, the hole can be of any shape that can fit betweenthe hooks on the contact side of the conductive hook material. Suitableshapes can include, for example, circles, ovals, squares, rectangles,triangles, and combinations thereof.

The size of the holes, number of holes and spacing between holes withinthe conductive hook material will depend on the desired end product.Typically, however, it is suitable to produce a conductive hook materialhaving a greater number of holes, each having a smaller diameter toreduce any solder material (when used) from flowing through in largeamounts and interfering with the electrical and physical connections ofthe hook material, while having a large enough diameter to allow enoughsolder material through to create a sufficient mechanical bond.Furthermore, by using smaller diameter-holes, a capillary action effectcan be produced, thereby allowing for a better wicking action of thesolder material up through the hole.

As noted above, a suitable solder material 11 is wicked through theholes 5A, 5B of the conductive hook material 1, thereby connecting theprinted circuit board 3 to the conductive hook material 1. Specifically,the non-contact side 7 of the conductive hook material 1 is directlyconnected to the printed circuit board 3.

Generally, soldering with a suitable solder material will melt thethermoplastic hook material. Once removed from the molten soldermaterial, the solder material will solidify and adhere around thethermoplastic hook material. One advantage of the thermoplasticmaterials used in the conductive hook material (and conductive loopmaterial) of the present disclosure is that the thermoplastic materialshave a low melting point and thus, can easily be melted withconventional soldering mechanisms using lower temperatures. Furthermore,by using hook and loop material-type fasteners, more electrical andmechanical connection points are created as compared to fastenersconventionally used with soldering printed circuit boards.

Suitable solder materials can include, but are not limited to, forexample, lead/tin alloys, lead-free tin alloys, tin/silver alloys,tin/silver/copper alloys, and tin/silver/copper/antimony alloys. In oneparticularly preferred embodiment, the solder material is a solder pastepart placement. For example, the solder paste contains particles oflead/tin alloy suspended in a gel, which are applied in a wet state tothe conductive hook material and printed circuit board. Once heat isapplied, the non-conductive gel melts away and the solder material meltsand bonds the connection points of the conductive hook material and thesolder pads of the printed circuit board.

In one particularly preferred embodiment, as shown in FIGS. 2A and 2B,the holes 5A, 5B in the conductive hook material 1 are conductivethroughholes comprising a metal 13 to produce a more robust electricalconnection. Suitable metals for use in the conductive throughholes caninclude, for example, aluminum, copper, iron, silver, gold, nickel,zinc, tine, and combinations thereof.

Suitably, the conductive throughholes can further include teeth 15 thatconnect to the internal sides of the conductive hook material. The teeth15 provide for a more secure connection as the teeth grip into theinternal sides of the conductive hook material forming a strongermechanical bond. Furthermore, the teeth provide a larger connectingsurface area and, thus a better electrical connection to the conductivehook material.

As an alternative to using holes in the conductive hook material, theconductive connector attachment can comprise a metal scrim layer to beused with the solder materials described above. Generally, the metalscrim layer 20 is located between the non-contact side 7 of theconductive hook material 1 and the printed circuit board 3 toelectrically connect the conductive hook material 1 to the printedcircuit board 3 using conventional soldering mechanisms (see FIG. 3A).Specifically, a layer of metal such as aluminum, copper, iron, silver,gold, nickel, zinc, tin, or a combination thereof, is applied betweenthe non-contact side of the conductive hook material and the printedcircuit board. The metal scrim layer 20 suitably provides mechanicalstrength and, can further provide a point of contact for the soldermaterial 11 to flow to during heating and attachment. The metal scrimlayer 20 is typically at least about 0.001 inches thick. More suitably,the metal scrim layer 20 has a thickness of from about 0.006 inches toabout 0.025 inches.

The metal scrim layer 20 can be applied between the conductive hookmaterial 1 and the printed circuit board 3 in any pattern known in theart. For example, in one embodiment, as shown in FIG. 3B, the metalscrim layer 20 is applied in a cross-hatched pattern. In anotherembodiment, the metal scrim layer is applied in a striped pattern.

In yet another alternative embodiment using the solder material asdescribed above, the conductive connector attachment comprises theconductive hook material 1, the printed circuit board 3, the soldermaterial 5, and the conductive loop material (not shown). In thisembodiment, however, the conductive hook material 1 comprises multiplehooks 30, 32, 34, 36, and 40, 42, 44, 46 on both its non-contact side 7and its contact side 9, respectively. As the solder material 5 describedabove is applied to the printed circuit board 3 and the non-contact sideof the conductive hook material 7 is placed in the molten soldermaterial during processing, the hooks 30, 32, 34, 36 on the non-contactside 7 melt. Furthermore, by immediately removing the hooks 30, 32, 34,36 from the heat, the solder material solidifies around the meltedportions of the hooks 30, 32, 34, 36, thereby forming a mechanical bondbetween the hooks 30, 32, 34, 36 of the non-contact side 7 of theconductive hook material 1 and the printed circuit board 3.

In one particularly preferred embodiment, the hooks on the non-contactside of the conductive hook material are strategically shaped into amushroom-cap shape (not shown) By using a mushroom-cap shape, the hooksmelt into a configuration that allows for better bonding with the soldermaterial, and thus, with the printed circuit board. Other suitableshapes for the hooks of the non-contact side can include stem-onlymushroom-cap hooks; that is mushroom-shaped hooks having the stems only.

As an alternative to using a soldering mechanism to bond the conductivehook material to the printed circuit board, a compression fit can beused to produce the conductive connector attachment of the presentdisclosure. For example, in one embodiment, the conductive connectorattachment is produced by bonding a stud attached to the non-contactside of the conductive hook material to the printed circuit boardthrough a via on the printed circuit board. Referring to FIG. 5A, theconductive connector attachment 10 comprises a conductive hook material1 including a contact side 9 with multiple hooks 40, 42, 44, 46 and anopposing non-contact side 7 comprising at least one stud 50. Moresuitably, the non-contact side 7 includes multiple studs (not shown).The stud 50 can compression fit into a via 60 located on the printedcircuit board 3, thereby connecting the non-contact side 7 of theconductive hook material 1 to the printed circuit board 3.

The studs can be made from any material known in the art. For example,in one embodiment, the studs are made of a metal selected from the groupconsisting of aluminium, copper, iron, silver, gold, nickel, zinc, tin,and combinations thereof. In another embodiment, the studs can suitablybe made from the same thermoplastic material used to make the conductivehook and loop materials, more specifically, polyolefins, nylon, styreneblock copolymers, and combinations thereof. Particularly preferredthermoplastic materials for use in making the studs of this embodimentinclude polyolefins such as polypropylene, polyethylene, andcombinations thereof.

Typically, the studs fill the entire length of the via in the printedcircuit board. As noted above, the printed circuit board for use in theconductive connector attachment of the present disclosure typically hasa thickness of from about 5 millimeters to about 125 millimeters, moresuitably, from about 20 millimeters to about 100 millimeters and, evenmore suitably, from about 30 millimeters to about 65 millimeters. Assuch, the studs for use in the conductive connector attachment of thepresent embodiment have a length of from about 5 millimeters to about125 millimeters. More suitably, the studs are from about 5 millimetersin length to about 100 millimeters in length and, even more suitably,from about 30 millimeters to about 65 millimeters.

Additionally, as shown in FIG. 5B, the studs of this embodiment canfurther be melted as described herein above to provide a bettermechanical connection to the printed circuit board. For example, thestuds can be secured through compression fit into the vias, and then,heated to melt the thermoplastic material to fill the vias and attachthe studs to the opposing side of the printed circuit board.

It should be noted that the studs of this embodiment can be of any shapesuitable in the art. Typically, the shape of the stud will varydepending on the shape of the via and the desired end product to beproduced.

In one particularly preferred embodiment, as shown in FIG. 5C, the stud50 further comprises a foot 70 that extends out from the non-contactside 7 of the conductive hook material 1. The foot allows for a strongermechanical attachment between the conductive hook material and theprinted circuit board (not shown).

Typically, the stud comprising the foot can be any shape available toone skilled in the art. Suitably, the stud can be in shapes includinground head nail-shaped, flat-top nail-shaped, screw-shaped,cylinder-shaped, hook-shaped, mushroom-cap shaped, taperedcylinder-shaped, and combinations thereof. In one particularly preferredembodiment, the stud is round head nail-shaped where the round head ofthe nail is directed towards the contact side of the conductive hookmaterial and away from the printed circuit board. In this specificconfiguration, the thermoplastic conductive hook material is melted andextruded around the head of the nail to create the mechanical andelectrical connection between the conductive hook material and thesolder material.

Similar to the throughhole in the embodiment described above, the studcan further include at least one or more teeth or barbs 72 that connectto the internal sides of the conductive hook material 1. As noted above,the teeth allow for greater surface area and chance of electricalconnection to the conductive hook material.

Optionally, in this embodiment, a solder material (not shown) asdescribed above can be used to more securely attach the conductive hookmaterial to the printed circuit board (not shown) through the stud andvia. Specifically, the solder material connects the stud on thenon-contact side of the conductive hook material to the via of theprinted circuit board. Suitable solder materials are discussed above.

It should be understood by one skilled in the art that while the presentdisclosure expressly discloses bonding the conductive hook material tothe printed circuit board, the present disclosure alternativelyrecognizes bonding of the conductive loop material to the printedcircuit board using the various mechanisms and configurations discussedabove.

Having described the disclosure in detail, it will be apparent thatmodifications and variations are possible without departing from thescope of the disclosure defined in the appended claims.

EXAMPLES

The following non-limiting examples are provided to further illustratethe present disclosure.

Example 1

In this Example, a conductive connector attachment was produced inaccordance with one embodiment of the present disclosure and itsconnection resistance was compared to a control attachment sample.

To produce the conductive connector attachment, round holes(approximately 2 mm to 4 mm) were made into a conductive hook material(commercially available as conductive VELCRO from Velcro USA, Inc.,Manchester, N.H.) using needle point. The conductive hook material wasthen adhered to a one-sixteenth inch thick metal plate using aconductive epoxy, available as a silver two-part epoxy (resin andhardener with suspended silver particles) from Chemtronics, Kennesaw,Ga. Specifically, the surface of the metal plate was roughed up using asteel brush. Then, a few grams of mixed epoxy were placed on an epoxypatch on the conductive hook material. Pressure was applied to allow forthe epoxy to push through the holes. The metal plate was then allowed tostand for approximately two hours in order for the epoxy to dry.

A control sample was also produced. The control sample consisted of theconductive hook material without holes adhered to a metal plate usingthe conductive epoxy described above.

Once produced, the connection resistance of the sample of conductiveconnector attachment and control attachment sample were measured fromthe top of the hooks on the conductive hook materials to one inchremoved on the metal plate using a Fluke 189 multimeter (commerciallyavailable from FLUKE Corporation, Everett, Wash.). The conductiveconnector attachment including the holes in the conductive hook materialshowed a connection resistance as measured between the hooks and themetal plate of approximately 500 Ohms. By comparison, the control sampleshowed a much greater connection resistance, specifically a connectionresistance of approximately 1.2 kOhms.

Example 2

In this Example, samples of conductive hook materials were directlysoldered to printed circuit boards using conventional solderingmechanisms. Specifically, the samples were produced by melting, at atemperature of approximately 315EC to 371EC (600-700EF) using a Wellersoldering iron, the thermoplastic material of the conductive hookmaterials (commercially available as conductive VELCRO from Velcro USA,Inc., Manchester, N.H.) into a solder material (commercially availableas Kester 24-6337-8213 (a 63% tin/37% lead alloy) from Digikeyelectronics, Thief River Falls, Minn.) and contacting the conductivehook materials to portions of the printed circuit boards (i.e., solderpads, each having a size of approximately 3 mm×7 mm) to createmechanical and electrical connections.

Connection resistance from the top of the hooks of the conductive hookmaterial to the base of the printed circuit board of each sample wasmeasured as in Example 1. Connection resistances were on the order offrom about 100 Ohms to about 500 Ohms. While the observed resistanceswere good, over time the opportunity for the formed cold joints tostress and become poorer electrical connections was found.

Example 3

In this Example, a sample of conductive connector attachment includingmetal throughholes in the conductive hook material was produced and itsconnection resistance was tested.

To produce the conductive connector attachment, the female portion ofmetal button snaps were placed through a conductive hook material(available as conductive VELCRO from Velcro USA, Inc., Manchester, N.H.)to produce a throughhole connection. The solder material, as used inExample 2, was applied to the snap throughhole and to a portion of aprinted circuit board (i.e., solder pad, having a size of approximately3 mm×7 mm). The snap throughhole connector of the conductive hookmaterial was then soldered to the printed circuit board.

Connection resistance from one solder pad on the printed circuit boardto one inch removed from the conductive hook material, taken through thesnap throughhole of the conductive hook material, was measured as inExamples 1 and 2. Connection resistance was approximately 1 kOhm;however, it was found that the connection resistance decreased as thedistance between the snap throughhole and the base of the conductivehook material was reduced. Specifically, the connection resistancedecreased to less than 400 Ohms.

When introducing elements of the present disclosure or the preferredembodiments(s) thereof, the articles “a”, “an”, “the” and “said” areintended to mean that there are one or more of the elements. The terms“comprising”, “including” and “having” are intended to be inclusive andmean that there may be additional elements other than the listedelements.

In view of the above, it will be seen that the several objects of thedisclosure are achieved and other advantageous results attained.

As various changes could be made in the above conductive connectorattachments and configurations without departing from the scope of theinvention, it is intended that all matter contained in the abovedescription and shown in the accompanying drawings shall be interpretedas illustrative and not in a limiting sense.

1. A conductive connector attachment for a printed circuit boardcomprising: a conductive hook material, wherein the hook materialcomprises multiple hooks on each of a contact side and a non-contactside, wherein the contact side and non-contact side are opposing sides,and wherein the multiple hooks on the non-contact side are from about 1micron to about 5 millimeters in length; a printed circuit board; asolder material, wherein the solder material electrically connects thehooks of the non-contact side of the conductive hook material to theprinted circuit board; and a conductive loop material that is compatiblewith the contact side of the conductive hook material.
 2. The conductiveconnector attachment as set forth in claim 1 wherein the conductive hookmaterial comprises a thermoplastic material selected from the groupconsisting of polyolefins, nylon, styrene block copolymers, andcombinations thereof.
 3. The conductive connector attachment as setforth in claim 2 wherein the conductive hook material is a polyolefinselected from the group consisting of polypropylene, polyethylene, andcombinations thereof.
 4. The conductive connector attachment as setforth in claim 1 wherein the multiple hooks on the non-contact side ofthe conductive hook material further comprise a mushroom-shaped cap. 5.The conductive connector attachment as set forth in claim 1 wherein themultiple hooks on the contact side of the conductive hook material arein a size ranging from about 1 micron to about 5 millimeters in length.6. The conductive connector attachment as set forth in claim 1 whereinthe conductive hook material further comprises vapor deposited metal onits surface.
 7. The conductive connector attachment as set forth inclaim 6 wherein the metal vapor deposited on the surface of theconductive hook material is selected from the group consisting ofaluminum, copper, iron, silver, gold, nickel, zinc, tin, andcombinations thereof.
 8. The conductive connector attachment as setforth in claim 7 wherein the metal vapor deposited on the surface of theconductive hook material is aluminum.
 9. The conductive connectorattachment as set forth in claim 6 wherein the surface of the conductivehook material comprises metal vapor deposited in a thickness rangingfrom about 20 angstroms to about 800 angstroms.
 10. The conductiveconnector attachment as set forth in claim 9 wherein the surface of theconductive hook material comprises metal vapor deposited in a thicknessranging from about 100 angstroms to about 400 angstroms.
 11. Theconductive connector attachment as set forth in claim 1 wherein theconductive loop material comprises a thermoplastic material selectedfrom the group consisting of polyolefins, nylon, styrene blockcopolymers, and combinations thereof.
 12. The conductive connectorattachment as set forth in claim 2 wherein the conductive loop materialis a polyolefin selected from the group consisting of polypropylene,polyethylene, and combinations thereof.
 13. The conductive connectorattachment as set forth in claim 1 wherein the conductive loop materialcomprises multiple loops, wherein the loops are from about 1 micron toabout 5 millimeters in length.
 14. The conductive connector attachmentas set forth in claim 13 wherein the conductive loop material comprisesvapor deposited metal on its surface.
 15. The conductive connectorattachment as set forth in claim 14 wherein the metal vapor deposited onthe surface of the conductive loop material is selected from the groupconsisting of aluminum, copper, iron, silver, gold, nickel, zinc, tin,and combinations thereof.
 16. The conductive connector attachment as setforth in claim 15 wherein the metal vapor deposited on the surface ofthe conductive loop material is aluminum.
 17. The conductive connectorattachment as set forth in claim 14 wherein the surface of theconductive loop material comprises metal vapor deposited in a thicknessranging from about 20 angstroms to about 800 angstroms.
 18. Theconductive connector attachment as set forth in claim 17 wherein thesurface of the conductive loop material comprises metal vapor depositedin a thickness ranging from about 100 angstroms to about 400 angstroms.19. The conductive connector attachment as set forth in claim 1 whereinthe solder material is selected from the group consisting of a lead/tinalloy, a lead-free tin alloy, a tin/silver alloy, a tin/silver/copperalloy, and a tin/silver/copper/antimony alloy.